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Advanced Thermal Soluti...
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ATS-X50170G-C1-R0 |
327Kb/1P |
Designed for 17x 17 mm components Rev - 040517 |
ATS-60000-C1-R0 |
301Kb/1P |
Designed for high performance in low air velocities Rev - 040517 |
ATS-60001-C1-R0 |
302Kb/1P |
Designed for high performance in low air velocities Rev - 040517 |
ATS-59003-C1-R0 |
137Kb/1P |
Designed for flip-chip processors such as NXP MPCs Rev - 230517 |
ATS-51400K-C1-R0 |
315Kb/1P |
Designed for low profile components from 1.5 to 2.99mm Rev - 040517 |
ATS-59008-C1-R0 |
330Kb/1P |
Designed for flip-chip processors such as NXP MPCs Rev - 230517 |
ATS-59010-C1-R0 |
59Kb/1P |
Designed for flip-chip processors such as NXP MPCs Rev - 230517 |
ATS-51190D-C1-R0 |
314Kb/1P |
Designed for low profile components from 1.5 to 2.99mm Rev - 040517 |
ATS-51330D-C1-R0 |
315Kb/1P |
Designed for low profile components from 1.5 to 2.99mm Rev - 040517 |
ATS-59001-C1-R0 |
133Kb/1P |
Designed for flip-chip processors such as NXP MPCs Rev - 230517 |
ATS-59005-C1-R0 |
304Kb/1P |
Designed for flip-chip processors such as NXP MPCs Rev - 230517 |
ATS-59006-C1-R0 |
284Kb/1P |
Designed for flip-chip processors such as NXP MPCs Rev - 230517 |
ATS-59009-C1-R0 |
118Kb/1P |
Designed for flip-chip processors such as NXP MPCs Rev - 230517 |
ATS-59002-C1-R0 |
133Kb/1P |
Designed for flip-chip processors such as NXP MPCs Rev - 230517 |
ATS-59004-C1-R0 |
281Kb/1P |
Designed for flip-chip processors such as NXP MPCs Rev - 230517 |
ATS-51330K-C1-R0 |
315Kb/1P |
Designed for low profile components from 1.5 to 2.99mm Rev - 040517 |
ATS-51190K-C1-R0 |
314Kb/1P |
Designed for low profile components from 1.5 to 2.99mm Rev - 040517 |
ATS-59000-C1-R0 |
343Kb/1P |
Designed for flip-chip processors such as NXP MPCs Rev - 230517 |
ATS-56002-C1-R0 |
315Kb/1P |
Designed specifically for ASIC package and their unique cooling requirements Rev - 040517 |
ATS-56011-C4-R0 |
345Kb/1P |
Designed specifically for ASIC package and their unique cooling requirements Rev - 040517 |